Patent Assignment
Reel/Frame 031408/0001
Assignment of Assignor's Interest
Recorded: 2013-10-15
Pages: 4
Assignors
LIU, TZUAN-HORNG
Executed: 2013-09-30
HUANG, SHIH-WEN
Executed: 2013-09-30
LU, CHUNG-YU
Executed: 2013-09-30
HU, HSIEN-PIN
Executed: 2013-09-30
HOU, SHANG YUN
Executed: 2013-09-30
JENG, SHIN-PUU
Executed: 2013-09-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Mechanism for Forming Patterned Metal Pad Connected to Multiple Through Silicon Vias (Tsvs)