Patent Assignment
Reel/Frame 031435/0979
Assignment of Assignor's Interest
Recorded: 2013-10-18
Pages: 3
Assignors
LIU, NAI-WEI
Executed: 2013-10-08
HUNG, JUI-PIN
Executed: 2013-10-08
LIN, JING-CHENG
Executed: 2013-10-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package Device and Manufacturing Method Thereof