Assignment of Assignor's Interest

Recorded: 2013-10-21 Pages: 3

Assignor

GUO, XIAO-YA

Executed: 2013-10-17

Assignee

AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.,ZHONGSHAN TORCH HI-TECH DEVELOPMENT ZONE, ZHONGSHAN, CHINA

Covered Property (1)

Package Structure for Duplexer, Method of Manufacturing the Same and Electronic Device with the Same

Patent: 9,264,014 →

Application: 14/058,349 →

Publication: US 2015/0028964

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.