Patent Assignment
Reel/Frame 031455/0642
Assignment of Assignor's Interest
Recorded: 2013-10-22
Pages: 5
Assignors
SHIM, JAE HYUK
Executed: 2013-10-08
OH, DAE BOK
Executed: 2013-10-08
CHOI, JAE YEOL
Executed: 2013-10-08
PARK, MYUNG JUN
Executed: 2013-10-08
LEE, YOUNG SOOK
Executed: 2013-10-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU,, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Ceramic Electronic Component, Manufacturing Method Thereof and Board for Mounting the Same