Patent Assignment
Reel/Frame 031460/0051
Assignment of Assignor's Interest
Recorded: 2013-10-23
Pages: 8
Assignors
GRATZ, ACHIM
Executed: 2013-06-06
WALLACE, SCOTT DAVID
Executed: 2013-06-05
JACOBS, TOBIAS
Executed: 2013-06-06
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Device Bond Pads Over Process Control Monitor Structures in a Semiconductor Die