IP Library › Assignment 031462/0601
Patent Assignment
Reel/Frame 031462/0601

Assignment of Assignor's Interest

Recorded: 2013-10-23 Pages: 4
Assignors
LIN, CHUNG-HSUN
Executed: 2013-03-13
LIN, YU-SHIANG
Executed: 2013-03-13
LO, SHIH-HSIEN
Executed: 2013-03-13
SILBERMAN, JOEL A.
Executed: 2013-03-13
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Hybrid Extremely Thin Silicon-on-Insulator (ETSOI) Structure to Minimize Noise Coupling from TSV
Patent: 9,087,909 →
Application: 13/961,003 →
Publication: US 2014/0264605
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052620/0961 →