IP Library Assignment 031462/0793
Patent Assignment
Reel/Frame 031462/0793

Assignment of Assignor's Interest

Recorded: 2013-10-23 Pages: 6
Assignors
XIU, YONGHAO
Executed: 2013-06-19
BAI, YIQUN
Executed: 2013-06-19
ANANTHAKRISHNAN, NISHA
Executed: 2013-10-22
RARAVIKAR, NACHIKET R.
Executed: 2013-06-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Epoxy-Amine Underfill Materials for Semiconductor Packages
Patent: 8,916,981 →
Application: 13/891,475 →
Publication: US 2014/0332966