Patent Assignment
Reel/Frame 031466/0512
Assignment of Assignor's Interest
Recorded: 2013-10-24
Pages: 4
Assignors
TIEN, YAO-WEI
Executed: 2013-04-09
LIAO, CHI-HUNG
Executed: 2013-04-09
LEE, MING-YI
Executed: 2013-04-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
System and Method for Defect Analysis of a Substrate