Patent Assignment
Reel/Frame 031508/0732
Assignment of Assignor's Interest
Recorded: 2013-10-30
Pages: 3
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
1 HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU-SI, CHUNGBUK 361-728, CHEONGJU-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Flexible Printed Circuit Board for Packaging Semiconductor Device and Method of Producing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.