Patent Assignment
Reel/Frame 031526/0823
Assignment of Assignor's Interest
Recorded: 2013-11-01
Pages: 5
Assignors
CHAE, EUN-HYUK
Executed: 2013-09-26
JUNG, JIN MAN
Executed: 2013-09-26
LEE, BYOUNG HWA
Executed: 2013-09-26
LEE, JIN WOO
Executed: 2013-09-26
KIM, KYU REE
Executed: 2013-09-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Ceramic Capacitor to Be Embedded in Board, Method of Manufacturing the Same, and Method of Manufacturing Board Having Multilayer Ceramic Capacitor Embedded Therein