Patent Assignment
Reel/Frame 031542/0057
Assignment of Assignor's Interest
Recorded: 2013-10-22
Pages: 5
Assignors
SUGO, MICHIHIRO
Executed: 2013-09-09
KATO, HIDETO
Executed: 2013-09-09
TAGAMI, SHOHEI
Executed: 2013-09-09
YASUDA, HIROYUKI
Executed: 2013-09-09
TANABE, MASAHITO
Executed: 2013-09-09
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Wafer Processing Laminate, Wafer Processing Member, Temporary Adhering Material for Processing Wafer, and Manufacturing Method of Thin Wafer