Patent Assignment
Reel/Frame 031543/0440
Assignment of Assignor's Interest
Recorded: 2013-11-05
Pages: 2
Assignors
CHANG, CHIN-CHUAN
Executed: 2013-03-26
LIN, JING-CHENG
Executed: 2013-03-26
YU, CHEN-HUA
Executed: 2013-03-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3D-Packages and Methods for Forming the Same