Patent Assignment
Reel/Frame 031550/0332
Assignment of Assignor's Interest
Recorded: 2013-10-29
Pages: 2
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO 1018980, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Method and Substrate Processing Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.