Patent Assignment
Reel/Frame 031562/0069
Assignment of Assignor's Interest
Recorded: 2013-11-07
Pages: 4
Assignors
CHANG, HONG-DA
Executed: 2013-08-29
LAI, YI-CHE
Executed: 2013-08-29
CHIU, CHI-HSIN
Executed: 2013-08-29
CHIU, SHIH-KUANG
Executed: 2013-08-29
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Semiconductor Package and Fabrication Method Thereof