Patent Assignment
Reel/Frame 031563/0320
Assignment of Assignor's Interest
Recorded: 2013-11-07
Pages: 3
Assignors
WANG, YEN-PING
Executed: 2013-10-24
LIU, MING-KAI
Executed: 2013-10-24
WU, KAI-CHIANG
Executed: 2013-10-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Method for Singulating Packaged Integrated Circuits and Resulting Structures