Patent Assignment
Reel/Frame 031567/0602
Assignment of Assignor's Interest
Recorded: 2013-11-08
Pages: 2
Assignors
TSENG, CHUN-HAO
Executed: 2013-10-17
KUO, YING-HAO
Executed: 2013-10-22
YEE, KUO-CHUNG
Executed: 2013-10-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HISN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Thermally Conductive Structure for Heat Dissipation in Semiconductor Packages