Patent Assignment
Reel/Frame 031575/0055
Assignment of Assignor's Interest
Recorded: 2013-11-11
Pages: 3
Assignors
LIN, JING-CHENG
Executed: 2013-10-28
TSAI, PO-HAO
Executed: 2013-10-28
SHIH, YING CHING
Executed: 2013-10-28
LU, SZU WEI
Executed: 2013-10-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof