Patent Assignment
Reel/Frame 031578/0348
Assignment of Assignor's Interest
Recorded: 2013-11-11
Pages: 8
Assignors
HAMADA, MITSUYOSHI
Executed: 2013-10-18
FURUSAWA, FUMIO
Executed: 2013-10-18
IKEZAWA, RYOICHI
Executed: 2013-10-18
TAKEMIYA, KEIZO
Executed: 2013-11-01
BABA, TORU
Executed: 2013-10-30
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Resin Molding Material for Sealing and Electronic Component Device
Application:
14/116,979 →
Publication:
US 2014/0128505