IP Library › Patent Application 14116979
Patent Application
App. No. 14/116,979

EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE

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Quick Facts
Patent No.
US None
App. No.
14/116,979
Abstract

An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

Claims (9)

1 . An epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxysilane compound.

2 . The epoxy resin molding material for sealing according to claim 1 , wherein (E1) the arylamino group-containing alkoxysilane compound is a compound represented by the following general formula (I):

wherein in the general formula (I), R 1 and R 2 each independently represent a hydrocarbon group having 1 to 6 carbon atoms, which may have a substituent; p represents an integer from 1 to 3; and q represents 2 or 3.

3 . The epoxy resin molding material for sealing according to claim 1 , wherein (E2) the epoxy group-containing alkoxysilane compound is at least one compounds represented by the following general formulas (II) or (III):

wherein the general formula (II), R 1 and R 2 each independently represent a hydrocarbon group having 1 to 6 carbon atoms, which may have a substituent; p represents an integer from 1 to 3; and q represents 2 or 3; and

wherein in the general formula (III), R 1 and R 2 each independently represent a hydrocarbon group having 1 to 6 carbon atoms, which may have a substituent; p represents an integer from 1 to 3; and q represents 2 or 3.

4 . The epoxy resin molding material for sealing according to claim 1 , wherein a total amount of (E1) the arylamino group-containing alkoxysilane compound in the epoxy resin molding material for sealing is from 10% by mass to 80% by mass with respect to a total amount of (E1) the arylamino group-containing alkoxysilane compound and (E2) the epoxy group-containing alkoxy silane compound in the epoxy resin molding material for sealing.

5 . The epoxy resin molding material for sealing according to claim 1 , wherein the total amount of (E1) the arylamino group-containing alkoxysilane compound and (E2) the epoxy group-containing alkoxy silane compound in the epoxy resin molding material for sealing is from 2% by mass to 15% by mass with respect to a total amount of the epoxy resin (A) in the epoxy resin molding material for sealing.

6 . An electronic component device comprising an element sealed with the epoxy resin molding material for sealing according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 11, 2013
From: HAMADA, MITSUYOSHI; FURUSAWA, FUMIO; IKEZAWA, RYOICHI; TAKEMIYA, KEIZO; BABA, TORU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031578/0348 →