Patent Assignment
Reel/Frame 031589/0927
Assignment of Assignor's Interest
Recorded: 2013-10-28
Pages: 2
Assignors
KIM, SUNG GOO
Executed: 2013-10-21
MOON, HYO JU
Executed: 2013-10-21
KIM, JONG YOUB
Executed: 2013-10-21
OH, JAE HYUK
Executed: 2013-10-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Pump Apparatus