Patent Assignment
Reel/Frame 031600/0242
Assignment of Assignor's Interest
Recorded: 2013-11-14
Pages: 3
Assignors
WU, CHIH-WEI
Executed: 2013-09-23
SHIH, YING-CHING
Executed: 2013-09-23
LU, SZU-WEI
Executed: 2013-09-23
LIN, JING-CHENG
Executed: 2013-09-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Stacking of Multiple Dies for Forming Three Dimensional Integrated Circuit (3DIC) Structure