IP Library Assignment 031601/0566
Patent Assignment
Reel/Frame 031601/0566

Change of Address

Recorded: 2013-11-08 Pages: 7
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-07
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2 MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polishing Slurry for Metal Films and Polishing Method
Patent: 8,609,541 →
Application: 12/667,154 →
Publication: US 2011/0009033
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2009
From: TANAKA, TAKAAKI; FUKASAWA, MASATO; NOBE, SHIGERU; SAKURADA, TAKAFUMI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 023724/0117 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →