Patent Assignment
Reel/Frame 031614/0867
Assignment of Assignor's Interest
Recorded: 2013-10-25
Pages: 2
Assignors
HAN, JAE HWAN
Executed: 2013-09-16
CHUN, BYOUNG JIN
Executed: 2013-09-16
HONG, KYUNG PYO
Executed: 2013-09-16
GU, HYUN HEE
Executed: 2013-09-16
JEON, BYUNG JUN
Executed: 2013-09-16
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YEONGTONG-GU,, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Conductive Paste Composition for External Electrode and Multilayer Ceramic Electronic Component Including the Same