Patent Assignment
Reel/Frame 031615/0484
Assignment of Assignor's Interest
Recorded: 2013-11-15
Pages: 4
Assignors
WU, YUNG-HSU
Executed: 2013-11-11
HUANG, CHIEN-HUA
Executed: 2013-11-11
LEE, CHUNG-JU
Executed: 2013-11-13
BAO, TIEN-I
Executed: 2013-11-13
SHUE, SHAU-LIN
Executed: 2013-11-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Device having Voids and Method of Forming Same