Patent Assignment
Reel/Frame 031629/0483
Assignment of Assignor's Interest
Recorded: 2013-11-19
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO. 8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Mechanisms for Forming Post-Passivation Interconnect Structure