Patent Assignment
Reel/Frame 031639/0659
Assignment of Assignor's Interest
Recorded: 2013-11-20
Pages: 4
Assignor
GOH, KOK CHAI
Executed: 2013-11-05
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Package with Multi-Level Die Block