Patent Assignment
Reel/Frame 031659/0261
Assignment of Assignor's Interest
Recorded: 2013-11-22
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Mechanisms for Forming Package Structure