IP Library › Assignment 031668/0510
Patent Assignment
Reel/Frame 031668/0510

Assignment of Assignor's Interest

Recorded: 2013-11-25 Pages: 5
Assignors
CHERN, CHYI SHYUAN
Executed: 2013-11-11
WU, HSIN-HSIEN
Executed: 2013-11-12
YU, CHIH-KUANG
Executed: 2013-11-12
KUO, HUNG-YI
Executed: 2013-11-08
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property (1)
Method and Apparatus for Accurate Die-to-Wafer Bonding
Patent: 8,722,436 →
Application: 14/088,780 →
Publication: US 2014/0065741
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0746 →
Change of Name Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037196/0751 →