Patent Assignment
Reel/Frame 037196/0746
Merger
Recorded: 2015-12-02
Pages: 5
Assignor
CHIP STAR LTD.
Executed: 2015-07-15
Assignee
EPISTAR CORPORATION
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Properties
(10)
Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
Light-Emitting Devices with Textured Active Layer
Light-Emitting Diode with Current-Spreading Region
Led Device with Improved Thermal Performance
Method and Apparatus for Accurate Die-to-Wafer Bonding
Light Emitting Diode Optical Emitter with Transparent Electrical Connectors
Method of Fabricating Light-Emitting Diode with a Micro-Structure Lens
Pre-Cutting a Back Side of a Silicon Substrate for Growing Better Iii-V Group Compound Layer on a Front Side of the Substrate
Application:
14/630,714 →
Publication:
US 2015/0171266
Light-Emitting Devices on Textured Substrates
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 029052/0838 →
Assignment of Assignor's Interest
Oct 1, 2012
From: HUANG, HSIN-CHIEH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 029052/0802 →
Assignment of Assignor's Interest
Nov 25, 2013
From: CHERN, CHYI SHYUAN; WU, HSIN-HSIEN; YU, CHIH-KUANG; KUO, HUNG-YI
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031668/0510 →
Assignment of Assignor's Interest
Sep 15, 2014
From: CHEN, YUNG-CHANG; WU, HSIN-HSIEN; LEE, MING SHING; LAI, HUAI-EN
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 033737/0301 →
Assignment of Assignor's Interest
Jan 27, 2015
From: HSIA, HSING-KUO; YU, CHIH-KUANG; KUO, HUNG-YI; CHERN, CHYI SHYUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034817/0357 →
Assignment of Assignor's Interest
Jan 27, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034817/0399 →
Assignment of Assignor's Interest
Feb 12, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034948/0232 →
Assignment of Assignor's Interest
Feb 12, 2015
From: LEE, HSIAO-WEN; TSAI, SHANG-YU; KO, PEI-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034948/0103 →
Assignment of Assignor's Interest
Feb 25, 2015
From: LI, ZHEN-YU; LIN, CHUNG-PAO; HSIA, HSING-KUO; KUO, HAO-CHUNG
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 035023/0561 →
Assignment of Assignor's Interest
Apr 15, 2015
From: HUANG, HSIN-CHIEH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035413/0593 →
Assignment of Assignor's Interest
Apr 15, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 035413/0644 →
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037196/0751 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0777 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037805/0762 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →