IP Library Granted Patent US 9,899,563
Granted Patent B2
US 9,899,563 · App. 14/620,481 · Granted Feb 20, 2018

Method of fabricating light-emitting diode with a micro-structure lens

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Quick Facts
Patent No.
US 9,899,563
App. No.
14/620,481
Granted
Feb 20, 2018
Kind
B2
Abstract

A light emitting diode (LED) with a micro-structure lens includes a LED die and a micro-structure lens. The micro-structure lens includes a convex lens portion, at least one concentric ridge structure surrounding the convex lens portion, and a lower portion below the convex lens portion and the at least one concentric ridge structure. The lower portion is arranged to be disposed over the LED die. A first optical path length from an edge of the LED die to a top center of the microstructure lens is substantially the same as a second optical path length from the edge of the LED die to a side of the micro-structure lens.

Claims (16)

1. A method of fabricating a light emitting diode (LED) with a micro-structure lens, comprising:

receiving a light emitting diode (LED) die on a substrate; and

molding the micro-structure lens that has at least one concentric ridge over the LED die,

wherein a first optical path length from an edge of the LED die to a top center of the micro-structure lens is substantially the same as a second optical path length from the edge of the LED die to a side of the micro-structure lens.

2. The method of claim 1 , further comprising forming a reflective layer on the substrate.

3. The method of claim 2 , further comprising forming a solder layer on the reflective layer.

4. The method of claim 1 , further comprising bonding the LED die to the substrate.

5. The method of claim 1 , further comprising wire bonding the LED die.

6. The method of claim 1 , further comprising forming a phosphor coating on the LED die.

7. The method of claim 1 , further comprising etching the micro-structure lens after the molding.

8. A method, comprising:

forming a reflective layer over a substrate;

bonding a light-emitting diode (LED) die to the reflective layer;

coating a phosphor material over the LED die; and

molding a lens over the LED die such that the lens is molded to have a convex lens portion and a plurality of ridges circumferentially surrounding the convex lens portion in a top view, wherein a first optical path length from an edge of the LED die to a top center of the lens is about the same as a second optical path length from an edge of the LED die to a side of the lens, and wherein the convex lens portion has a greater lateral dimension than the LED die.

9. The method of claim 8 , wherein the molding of the lens comprises molding a curved side surface of the lens and molding pointed or curved peaks for the plurality of ridges, respectively.

Assignments (5)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
MERGER Recorded Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0746 →
CHANGE OF NAME Recorded Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037196/0751 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2015
From: LEE, HSIAO-WEN; TSAI, SHANG-YU; KO, PEI-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034948/0103 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034948/0232 →