Patent Assignment
Reel/Frame 037805/0762
Change of Name
Recorded: 2016-02-23
Pages: 15
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9 LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Properties
(11)
High Efficiency Light Emitting Diodes
Phosphor with CE3+/CE3+, Li+ Doped Luminescent Materials
Light Emitting Diode Device with Effective Heat Dissipation
Light Emitting Diode Components Integrated with Thermoelectric Devices
Etching Growth Layers of Light Emitting Devices to Reduce Leakage Current
Wafer Level Conformal Coating for Led Devices
Nitridosilicate Phosphor Tunable Light-Emitting Diodes by Using Uv and Blue Chips
Light Cavity That Improves Light Output Uniformity
Tunable Phosphor for Luminescent
Light Emitting Diode and Method of Fabrication Thereof
Led Device with Improved Thermal Performance
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 28, 2011
From: YANG, HAO-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026032/0587 →
Assignment of Assignor's Interest
Jan 27, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 034817/0399 →
Assignment of Assignor's Interest
Jan 27, 2015
From: HSIA, HSING-KUO; YU, CHIH-KUANG; KUO, HUNG-YI; CHERN, CHYI SHYUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034817/0357 →
Merger
Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0746 →
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037196/0751 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0777 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →