Light emitting diode device with effective heat dissipation

1. A light emitting diode device comprising:

a housing having a heat sink and a vapor chamber, the heat sink being integrated into the housing, the vapor chamber and the heat sink collectively defining an enclosed space; and

one or more light emitting diode modules attached to the housing adjacent to the vapor chamber, the one or more light emitting diode modules adapted to emit light and heat during operation,

wherein the vapor chamber is adapted to disperse heat generated from the light emitting diode modules within the enclosed space to form a temperature field on the heat sink for heat dissipation.

2. The device of claim 1 , wherein the housing further comprises:

a control box with a heat sink, the housing adapted to be attached to the control box for waterproof assembly; and

a cover adapted to enclose a controller and power supply,

wherein the controller and power supply are adapted to be attached to the control box and enclosed by the cover for waterproof assembly, and

wherein the heat sink of the control box is adapted to dissipate heat from the controller and power supply.

3. The device of claim 1 , wherein the light emitting diode modules are waterproof, and wherein each light emitting diode module comprises one or more light emitting diode components adapted to emit light when voltage from the power supply is applied thereto, and wherein the light emitting diode modules are attached to the housing with one or more fasteners.

4. The device of claim 2 , wherein the housing further comprises one or more electrical connectors, and wherein each light emitting diode module comprises at least one electrical connector that corresponds to at least one electrical connector of the housing so that the housing is adapted to be electrically connected to the light emitting diode modules.

5. The device of claim 4 , wherein the electrical connectors are adapted to provide each light emitting diode module with an electrical connection to the controller and power supply within the control box for operation of the light emitting diode modules.

6. The device of claim 1 , wherein the vapor chamber is adapted to transfer heat from the light emitting diode modules to the heat sink.

7. The device of claim 1 , wherein an interior region of the enclosed space of the vapor chamber comprises an empty space that is filled with a fluid including at least one of water and alcohol.

8. The device of claim 1 , wherein an interior region of the enclosed space of the vapor chamber comprises a porous material that is filled with a fluid including at least one of water and alcohol,

wherein the porous material operates with a capillary action to circulate the fluid within the enclosed space of the vapor chamber.

9. A device comprising:

one or more light emitting diode modules adapted to emit light and generate heat during operation;

a vapor chamber adapted to disperse heat generated from the light emitting diode modules;

a heat sink adapted to dissipate heat transferred from the vapor chamber; and

a housing that includes an integrated combination of the heat sink and the vapor chamber, the vapor chamber defining a partially enclosed space to disperse heat in the vapor chamber and to form a temperature field on the heat sink to thereby provide heat dissipation.

10. The device of claim 9 , wherein the housing further comprises:

a control box with a heat sink, the housing adapted to be attached to the control box for waterproof assembly; and

a cover adapted to enclose a controller and power supply,

wherein the controller and power supply are adapted to be attached to the control box and enclosed by the cover for waterproof assembly, and

wherein the heat sink of the control box is adapted to dissipate heat from the controller and power supply.

11. The device of claim 9 , wherein the light emitting diode modules are waterproof, and wherein the light emitting diode modules are attached to the housing adjacent to the vapor chamber with one or more fasteners, and wherein each light emitting diode module comprises one or more light emitting diode components adapted to emit light when voltage from the power supply is applied thereto.

12. The device of claim 10 , wherein the housing further comprises one or more electrical connectors, and wherein each light emitting diode module comprises at least one electrical connector that corresponds to at least one electrical connector of the housing so that the housing is adapted to be electrically connected to the light emitting diode modules, and wherein the electrical connectors are adapted to provide each light emitting diode module with an electrical connection to the controller and power supply within the control box for operation of the light emitting diode modules.

13. The device of claim 9 , wherein the vapor chamber is adapted to transfer heat from the light emitting diode modules to the heat sink.

14. The device of claim 9 , wherein an interior region of the partially enclosed space of the vapor chamber comprises an empty space that is filled with a fluid including at least one of water and alcohol.

15. The device of claim 9 , wherein an interior region of the partially enclosed space of the vapor chamber comprises a porous material that is filled with a fluid including at least one of water and alcohol,

wherein the porous material operates with a capillary action to circulate the fluid within the partially enclosed space of the vapor chamber.

16. A heat transfer method for a light emitting diode device, the method comprising:

operating one or more light emitting diode modules to emit light, the light emitting diode modules generating heat during operation;

transferring heat from the light emitting diode modules to a vapor chamber;

dispersing heat transferred from the light emitting diode modules throughout an enclosed space of the vapor chamber;

transferring heat from the vapor chamber to a heat sink that is an integrated part of a housing for the one or more light emitting diode modules; and

dispersing heat from the heat sink,

wherein the vapor chamber is adapted to disperse heat from the light emitting diode modules so as to form a temperature field on the heat sink to thereby provide heat dissipation.

17. The method of claim 16 , wherein:

the heat sink and the vapor chamber collectively define an enclosed space to disperse heat in the vapor chamber and to form a temperature field on the heat sink to thereby provide heat dissipation, and

the light emitting diode modules are attached to the housing adjacent to the vapor chamber and each light emitting diode module comprises one or more light emitting diode components adapted to emit light.

18. The method of claim 16 , wherein: the light emitting diode modules are waterproof, and the heat sink is waterproof.

19. The method of claim 16 , wherein an interior region of the enclosed space of the vapor chamber comprises an empty space that is filled with a fluid including at least one of water and alcohol.

20. The method of claim 16 , wherein an interior region of the enclosed space of the vapor chamber comprises a porous material that is filled with a fluid including at least one of water and alcohol,

wherein the porous material operates with a capillary action to circulate the fluid within the enclosed space of the vapor chamber.