IP Library › Assignment 027899/0322
Patent Assignment
Reel/Frame 027899/0322

Assignment of Assignor's Interest

Recorded: 2012-03-21 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Light Emitting Diode Device with Effective Heat Dissipation
Patent: 8,529,098 →
Application: 12/940,151 →
Publication: US 2012/0113639
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 19, 2011
From: LEE, HSIAO-WEN; FU, HUEH-HUNG; WANG, JIN-HUA; YEH, CHIEN-LIANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025657/0553 →
Change of Name Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037805/0762 →
Merger Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0777 →