Patent Assignment
Reel/Frame 035023/0561
Assignment of Assignor's Interest
Recorded: 2015-02-25
Pages: 5
Assignors
LI, ZHEN-YU
Executed: 2012-09-24
LIN, CHUNG-PAO
Executed: 2012-09-24
HSIA, HSING-KUO
Executed: 2012-09-24
KUO, HAO-CHUNG
Executed: 2012-09-24
SHU, CINDY HUICHUN
Executed: 2012-10-03
HUANG, HSIN-CHIEH
Executed: 2012-10-02
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH RD., HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Pre-Cutting a Back Side of a Silicon Substrate for Growing Better Iii-V Group Compound Layer on a Front Side of the Substrate
Application:
14/630,714 →
Publication:
US 2015/0171266
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.