Patent Assignment
Reel/Frame 031681/0031
Assignment of Assignor's Interest
Recorded: 2013-11-26
Pages: 4
Assignors
TSAI, SHU-TING
Executed: 2013-11-20
YAUNG, DUN-NIAN
Executed: 2013-11-20
LIU, JEN-CHENG
Executed: 2013-11-20
CHOU, SHIH PEI
Executed: 2013-11-20
CHEN, U-TING
Executed: 2013-11-20
LIN, CHIA-CHIEH
Executed: 2013-11-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structure for Connecting Dies and Methods of Forming the Same