Assignment of Assignor's Interest

Recorded: 2013-11-27 Pages: 2

Assignor

KATO, OSAMU

Executed: 2013-11-04

Assignee

LAPIS SEMICONDUCTOR CO., LTD.

2-4-8 SHINYOKOHAMA, KOUHOKU-KU,, YOKOHAMA, 222-8575, JAPAN

Covered Property (1)

Semiconductor Device Including Bottom Surface Wiring and Manufacturing Method of the Semiconductor Device

Application: 14/027,263 →

Publication: US 2014/0073129

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.