Patent Assignment
Reel/Frame 031687/0860
Assignment of Assignor's Interest
Recorded: 2013-11-27
Pages: 7
Assignors
KIM, KWANGHO
Executed: 2013-08-18
JEUNG, JINHYUK
Executed: 2013-08-19
KO, HYUNGJONG
Executed: 2013-08-19
ROH, HOSUNG
Executed: 2013-08-19
PARK, HOJIN
Executed: 2013-08-20
LEE, SUN-KYU
Executed: 2013-08-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Body Bias Method Thereof