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Patent Assignment
Reel/Frame 031688/0690

Assignment of Assignor's Interest

Recorded: 2013-11-27 Pages: 3
Assignors
JEN, CHI-CHUNG
Executed: 2013-10-29
HSU, CHIA-LUN
Executed: 2013-11-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Metal-Insulator-Metal (Mim) Capacitor Structure Including Redistribution Layer
Patent: 9,324,780 →
Application: 14/069,864 →
Publication: US 2015/0123242