Patent Assignment
Reel/Frame 031698/0166
Assignment of Assignor's Interest
Recorded: 2013-12-02
Pages: 10
Assignors
CHEN, CHIN-LIANG
Executed: 2013-11-22
LIN, WEI-TING
Executed: 2013-11-22
HO, KUAN-LIN
Executed: 2013-11-22
LIU, YU-CHIH
Executed: 2013-11-22
LIN, CHUN-CHENG
Executed: 2013-11-22
LIN, SHIH-YEN
Executed: 2013-11-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Adhesive Pattern for Advance Package Reliability Improvement