Patent Assignment
Reel/Frame 031705/0619
Release of Security Interest
Recorded: 2013-12-03
Pages: 5
Assignor
HERCULES TECHNOLOGY III, L.P.
Executed: 2013-11-26
Assignee
BRIDGEWAVE COMMUNICATIONS, INC.
3350 THOMAS ROAD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(4)
High Frequency Device Packages and Methods
A Process of Manufacturing High Frequency Device Packages
Low Cost High Frequency Device Package and Methods
Method of Making a High Frequency Device Package
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2008
From: SANJUAN, ERIC A.; CAHILL, SEAN S.
To: BRIDGEWAVE COMMUNICATIONS, INC.
Reel/Frame 020697/0537 →
Release of Security Interest
Sep 29, 2008
From: COMDISCO VENTURES, INC.
To: BRIDGE WAVE COMMUNICATIONS, INC.
Reel/Frame 021603/0665 →
Security Agreement
Apr 14, 2010
From: BRIDGEWAVE COMMUNICATIONS, INC.
To: SQUARE 1 BANK
Reel/Frame 024233/0257 →
Assignment of Assignor's Interest
Dec 2, 2011
From: SANJUAN, ERIC A.; CAHILL, SEAN S.
To: BRIDGEWAVE COMMUNICATIONS, INC.
Reel/Frame 027317/0930 →
Lien
Dec 26, 2012
From: BRIDGEWAVE COMMUNICATIONS, INC., A CALIFORNIA CORPORATION
To: REMEC BROADBAND WIRELESS, LLC; REMEC BROADBAND WIRELESS INTERNATIONAL, INC.
Reel/Frame 029526/0863 →
Security Agreement
Feb 6, 2013
From: BRIDGEWAVE COMMUNICATIONS, INC.
To: HERCULES TECHNOLOGY III, L.P.
Reel/Frame 029769/0001 →
Release of Security Interest
Jul 29, 2013
From: SQUARE 1 BANK
To: BRIDGEWAVE COMMUNICATIONS, INC.
Reel/Frame 030892/0677 →
Release of Security Interest
Dec 3, 2013
From: REMEC BROADBAND WIRELESS, LLC; REMEC BROADBAND WIRELESS INTERNATIONAL, INC.
To: BRIDGEWAVE COMMUNICATIONS, INC.
Reel/Frame 031753/0014 →
Assignment of Assignor's Interest
Feb 27, 2014
From: BRIDGEWAVE COMMUNICATIONS, INC.
To: ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG
Reel/Frame 032313/0005 →