Process of manufacturing high frequency device packages
View Patent ↗A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a conductive material to form a center conductor for a coaxial via structure.
1. A method of fabricating a conductive base structure with coaxial vias, comprising:
selectively patterning an insulating material attached to a foundation layer to form an etched insulating material;
plating said etched insulating material with a conductive material to form the conductive base structure that includes a center conductor and a conductive shield surrounding the etched insulating material; and
separating the foundation layer from the etched insulating material, the center conductor, and the conductive shield, to form a coaxial via structure through the conductive base structure.
2. The method of claim 1 , wherein the insulating material comprises SU- 8 .
3. The method of claim 2 farther comprising glazing said insulating material layer.
4. The method of claim 1 further comprising applying an adhesive layer to secure the insulating material to the foundation layer.
5. The method of claim 4 , wherein applying the adhesive layer further comprises plating the adhesive layer with gold.
6. The method of claim 4 , wherein applying the adhesive layer further comprises plating the adhesive layer with gold and then nickel.