Assignment of Assignor's Interest

Recorded: 2013-12-04 Pages: 4

Assignors

OBU, ISAO

Executed: 2013-11-27

OSAKABE, SHINYA

Executed: 2013-11-25

Assignee

MURATA MANUFACTURING CO., LTD.

10-1 HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN

Covered Property (1)

Bump-Equipped Electronic Component and Method for Manufacturing Bump-Equipped Electronic Component

Patent: 9,343,360 →

Application: 14/096,044 →

Publication: US 2014/0151874