Patent Assignment
Reel/Frame 031714/0300
Assignment of Assignor's Interest
Recorded: 2013-12-04
Pages: 4
Assignors
CHEN, WEI-YU
Executed: 2013-11-19
HU, YU-HSIANG
Executed: 2013-11-19
LIN, WEI-HUNG
Executed: 2013-11-19
CHENG, MING-DA
Executed: 2013-11-19
LIU, CHUNG-SHI
Executed: 2013-11-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Warpage Control in Package-on-Package Structures