Patent Assignment
Reel/Frame 031717/0321
Assignment of Assignor's Interest
Recorded: 2013-12-04
Pages: 4
Assignors
HUNG, WENSEN
Executed: 2013-11-22
HUANG, SZU-PO
Executed: 2013-11-22
LEE, HSIANG-FAN
Executed: 2013-11-25
CHEN, KIM HONG
Executed: 2013-11-25
WU, CHI-HSI
Executed: 2013-11-25
JENG, SHIN-PUU
Executed: 2013-11-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TSMC)
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3DIC Packaging with Hot Spot Thermal Management Features