Patent Assignment
Reel/Frame 031721/0206
Assignment of Assignor's Interest
Recorded: 2013-12-05
Pages: 2
Assignor
XUE, YAN XUN
Executed: 2013-12-04
Assignee
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
475 OAKMEAD PKWY,, SUNNYVALE, CALIFORNIA, 94085
Covered Property
(1)
Method and Structure for Wafer Level Packaging with Large Contact Area