Patent Assignment
Reel/Frame 031742/0296
Change of Name
Recorded: 2013-12-09
Pages: 7
Assignor
LSI LOGIC CORPORATION
Executed: 2007-04-06
Assignee
LSI CORPORATION
1320 RIDDER PARK DRIVE, SAN JOSE, CALIFORNIA, 95131
Covered Property
(1)
Alternate Pad Structures/Passivation Integration Schemes to Reduce or Eliminate Imc Cracking in Post Wire Bonded Dies During Cu/Low-K Beol Processing
Application:
14/045,081 →
Publication:
US 2014/0030541
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 5, 2013
From: BHATT, HEMANSHU; VIJAY, DILIP; PALLINTI, JAYANTHI; SUN, SEY-SHING
To: LSI LOGIC CORPORATION
Reel/Frame 031721/0314 →
Patent Security Agreement
May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Assignment of Assignor's Interest
Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031)
Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Security Interest
Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →