Patent Assignment
Reel/Frame 031743/0221
Assignment of Assignor's Interest
Recorded: 2013-12-09
Pages: 2
Assignors
CHANG, CHIN-CHUAN
Executed: 2013-12-04
FU, TSEI-CHUNG
Executed: 2013-12-04
LIN, JING-CHENG
Executed: 2013-12-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TSMC)
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Protective Layer for Contact Pads in Fan-out Interconnect Structure and Method of Forming Same