IP Library › Assignment 031755/0123
Patent Assignment
Reel/Frame 031755/0123

Assignment of Assignor's Interest

Recorded: 2013-12-10 Pages: 7
Assignors
KIM, SEOUNG-HYUN
Executed: 2013-12-03
PARK, YOON-DONG
Executed: 2013-12-03
LEE, YONG-JEI
Executed: 2013-12-03
GONG, JOO-YEONG
Executed: 2013-12-04
PARK, HEE-WOO
Executed: 2013-12-03
CHA, SEUNG-WON
Executed: 2013-12-03
KIM, SUNG-CHUL
Executed: 2013-12-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Depth Pixel Included in Three-Dimensional Image Sensor, Three-Dimensional Image Sensor Including the Same and Method of Operating Depth Pixel Included in Three-Dimensional Image Sensor
Patent: 9,673,237 →
Application: 14/101,376 →
Publication: US 2014/0225173