Patent Assignment
Reel/Frame 031762/0472
Assignment of Assignor's Interest
Recorded: 2013-12-11
Pages: 4
Assignors
BAE, HYEON MIN
Executed: 2013-12-03
SONG, HA IL
Executed: 2013-12-03
JIN, HUXIAN
Executed: 2013-12-03
Assignee
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
291 DAEHAK-RO, YUSEONG-GU, DAEJEON, 305-701, KOREA, REPUBLIC OF
Covered Property
(1)
Low Power, High Speed Multi-Channel Chip-to-Chip Interface Using Dielectric Waveguide
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.