Patent Assignment
Reel/Frame 031775/0661
Assignment of Assignor's Interest
Recorded: 2013-12-12
Pages: 4
Assignors
HUANG, PEI-WEN
Executed: 2013-12-04
TING, CHIH-YUAN
Executed: 2013-12-04
SHIEH, JYU-HORNG
Executed: 2013-12-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming Integrated Circuit with Conductive Line Having Line-Ends